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IPC 2582 : 2007

Current

Current

The latest, up-to-date edition.

SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION

Published date

06-26-2007

1 SCOPE
  1.1 Intent
  1.2 Interpretation
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
  3.1 Terms and Definitions
  3.2 Categories and Content
4 GENERAL RULES
  4.1 Administration
  4.2 Content Element
      4.2.1 FunctionMode
      4.2.2 StepRef
      4.2.3 LayerRef
      4.2.4 BomRef
      4.2.5 AvlRef
      4.2.6 DictionaryStandard
      4.2.7 DictionaryUser
      4.2.8 DictionaryFont
      4.2.9 DictionaryLineDesc
      4.2.10 DictionaryColor
      4.2.11 DictionaryFirmware
  4.3 Logistic Header Elements
      4.3.1 Role
      4.3.2 Enterprise
      4.3.3 Person
  4.4 History Record Elements
      4.4.1 HistoryRecord
5 MODELING
6 REPORT GENERATORS
7 REFERENCE INFORMATION
  7.1 IPC
  7.2 American National Standards Institute
  7.3 Department of Defense
  7.4 Electronic Industries Association
  7.5 International Electrotechnical Commission (IEC)
  7.6 International Organization for Standards (ISO)
APPENDIX A - ADMINISTRATIVE SCHEMA

Describes the XML schema that represents the intelligent data file format used to describe administration information related to ordering and specifying printed boards, printed board assemblies, fixtures, and components.

DevelopmentNote
IPC 2581 is a mandatory part of this standard. (07/2007)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

BS EN 61182-2-2:2012 Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
I.S. EN 61182-2-2:2012 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))
EN 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
IPC 2588 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION
IPC 2583 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION
IPC 2584 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION
IEC 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

ANSI Y14.5 : 1973 DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
IPC 2611 : 0 GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION
DOD STD 100 : C NOTICE 6 ENGINEERING DRAWING PRACTICES
IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
ANSI Z210.1 : LATEST METRIC PRACTICE GUIDE
IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC D 310 : C GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES
IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY

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