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IPC 2583 : 2007

IPC 2583 : 2007

Current

Current

The latest, up-to-date edition.

SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION

Available format(s)

Hardcopy

Language(s)

English

Published date

02-19-2021

Publisher

Institute of Printed Circuits

1 SCOPE
  1.1 Intent
  1.2 Interpretation
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
  3.1 Terms and Definitions
  3.2 Categories and Content
4 GENERAL RULES
  4.1 Documentation
  4.2 Content Element
  4.3 LogisticHeader Elements
  4.4 History Record Elements
  4.5 Documentation Layers
      4.5.1 CadHeader
      4.5.2 CadData
      4.5.3 Step/LayerFeature
      4.5.4 Step/Datum
      4.5.5 Step/Profile
      4.5.6 Step/Package
      4.5.7 Step/Component
  4.6 Miscellaneous Step Descriptions
      4.6.1 CadHeader
      4.6.2 CadData
      4.6.3 Step/LayerFeature
  4.7 Design for eXcellence Elements
      4.7.1 DfxMeasurementList
5 MODELING
6 DOCUMENTATION EXAMPLES
7 REFERENCE INFORMATION
  7.1 IPC
  7.2 American National Standards Institute
  7.3 Department of Defense
  7.4 Electronic Industries Association
  7.5 International Electrotechnical Commission (IEC)
  7.6 International Organization for Standards (ISO)
APPENDIX A - DRAWING METHOD SCHEMA

Describes the XML schema that represents the intelligent data file format used to describe design characteristics for manufacturing data description.

DevelopmentNote
IPC 2581 is a mandatory part of this standard. (08/2007)
DocumentType
Standard
Pages
0
PublisherName
Institute of Printed Circuits
Status
Current

BS EN 61182-2-2:2012 Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
I.S. EN 61182-2-2:2012 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))
EN 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
IPC 2584 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION
IEC 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

ANSI Y14.5 : 1973 DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
IPC 2582 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION
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ANSI Z210.1 : LATEST METRIC PRACTICE GUIDE
ANSI INCITS TR 1 : 1982 DICTIONARY FOR INFORMATION PROCESSING - AMERICAN NATIONAL
IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC D 310 : C GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES
IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY

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