Name: IPC D 326 : A
Brand: IPC

INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES

Published date

01-01-2004

Publisher

Institute of Printed Circuits

1.0 SCOPE
     1.1 Purpose
     1.2 Classification
2.0 APPLICABLE AND REFERENCE DOCUMENTS
     2.1 Applicable Documents
     2.2 Reference Documents
3.0 DOCUMENTATION CONSIDERATIONS
     3.1 Terms and Definitions
4.0 THE STATEMENT OF WORK
     4.1 Bill of Materials
     4.2 Assembly Identification
     4.3 Documentation Listing
     4.4 Test Requirements
     4.5 Programmable Devices
     4.6 Packaging for Shipment
     4.7 Marking Requirements
     4.8 Quality System Requirements
     4.9 ESS Requirements
     4.10 Workmanship Standards
     4.11 Models or Illustrations
     4.12 Quantity and Delivery
     4.13 Other Relevant Business Practices for
          Assembly Services
5.0 THE BILL OF MATERIAL
     5.1 Component Detail
     5.2 Qualified Parts List
     5.3 Component History Records
     5.4 Component Traceability Record
     5.5 Defective Material Record
6.0 THE ASSEMBLY DOCUMENTATION
     6.1 The Assembly Drawing
     6.2 Product Process Routing
     6.3 Operation Instructions
7.0 TEST DOCUMENTATION
     7.1 Test Procedure
     7.2 Schematics
8.0 ENVIRONMENTAL STRESS SCREENING (ESS)
Figures
Tables

Covers the information requirements for the procurement of material, assembly, inspection, test, burn in and delivery of electronic assemblies. It outlines an effective method for transferring product assembly information within a facility or from an outside customer to a contract assembly facility.

DevelopmentNote	Included in IPC C 106. (06/2008) Included in IPC C 103 & IPC C 1000. (07/2008)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Current

IPC D 325 : A

DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS

IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 7721 : 1998	REPAIR AND MODIFICATION OF PRINTED BOARDS AND ELECTRONIC ASSEMBLIES
IPC 7711 : 1998	REWORK OF ELECTRONIC ASSEMBLIES
IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC EMSI TC2 : 2002	SAMPLE MASTER ORDERING AGREEMENT FOR EMS COMPANIES AND OEMS
IPC D 325 : A	DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
IPC A 610 : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC CM 770 : E	COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS
MIL C 45662 : 0	CALIBRATION SYSTEM REQUIREMENTS
IPC 9191 : 0	GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)