IPC J STD 012 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
Hardcopy
10-01-2013
English
1 SCOPE
1.1 Purpose
1.2 Categorization
2 TECHNOLOGY OVERVIEW
2.1 History of Flip Chip
2.2 Introduction to Chip Scale Packaging
3 APPLICATIONS OF FLIP CHIP AND CHIP SCALE
4 DESIGN CONSIDERATIONS
4.1 Chip Scale Standardization
4.2 General Considerations for Flip Chips
4.3 General Considerations for Chip Scale
4.4 Substrate Structure Standard Grid Evolution
4.5 Design Output Requirements
4.6 Electrical Design
4.7 Thermal Design
5 MATERIAL PROPERTIES AND PROCESSES
5.1 Solder Bumping
5.2 Conductive Adhesives
5.3 Solder Bump Evaluation
5.4 Other Bumping Techniques and Materials
5.5 Chip Materials
5.6 Other Bumping Process Considerations
5.7 Handling, Shipping and Storage
6 MOUNTING AND INTERCONNECTION STRUCTURES
6.1 Background
6.2 Mounting Structures General Considerations
6.3 Interconnection Substrate Material Choices
6.4 Surface Finish Properties
6.5 Substrate Constructions
6.6 Thermal Requirements
7 ASSEMBLY PROCESSES
7.1 Substrate Preparation
7.2 Chip and Chip Scale Placement
7.3 Attachment Processes
7.4 Cleaning
7.5 Attachment Inspection
7.6 Underfill (Flip Chip Encapsulation)
7.7 Electrical Test
7.8 Rework
8 FLIP CHIP TEST AND BURN-IN METHODOLOGY
8.1 Known Good Die
8.2 KGD Techniques for Flip Chip
8.3 Known-Good Mounting and Interconnection Structure
8.4 Product Verification
9 REQUIREMENTS FOR RELIABILITY
9.1 Robustness of Product to Use
9.2 Reliability of Factors
9.3 Reliability Testing
9.4 Design for Reliability (DfR)
10 STANDARDIZATION
10.1 Standards for Development
10.2 Flip Chip Development and Performance Standards
10.3 Standard on Mounting of Substrate Design and
Performance
10.4 Flip Chip/Substrate Assembly Design and Performance
Standards
10.5 Standards for Material Performance
11 FUTURE NEEDS
11.1 Critical Factor: Manufacturing Infrastructure
11.2 Critical Factor: Bump Attachment and Bonding
11.3 Critical Factor: Testing Scenarios
11.4 Total Quality Management and Manufacturing (TQMM)
Figures
Tables
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