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IPC J STD 028 : 0

IPC J STD 028 : 0

Current

Current

The latest, up-to-date edition.

PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS

Published date

08-01-1999

Publisher

Institute of Printed Circuits

Determines construction detail requirements for bumps and other terminal structures used for Flip Chip and Chip Scale carriers. Matches defined standards for differing terminations to a particular interconnection process; includes solder bumps, columns, non-melting stand-offs and conductive polymer deposits.

DevelopmentNote
Included in IPC C 103 & IPC C 1000. (08/2008) Jointly published by IPC & EIA. (01/2018)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current

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