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JIS C 6480:1994

JIS C 6480:1994

Current

Current

The latest, up-to-date edition.

General rules of copper-clad laminates for printed wiring boards

Available format(s)

Hardcopy , PDF

Language(s)

English, Japanese

Published date

02-28-1994

Publisher

Japanese Standards Association

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This Japanese Industrial Standard specifies the basic matters for determination of classes, performances, marking, etc. of copper-clad laminates for printed wiring boards, and multilayer printed wiring boards (hereafter referred to as "copper-clad laminates").

DocumentType
Standard
Pages
9
PublisherName
Japanese Standards Association
Status
Current

Reaffirmed 2015 94(R2015) [20/10/2015]94(R2010) [01/10/2010]94(R2001) [20/09/2001]94 [01/01/1994]8986

JIS C 6481:1996 Test methods of copper-clad laminates for printed wiring boards
JIS C 6511:1992 Test Methods Of Copper Foil For Printed Wiring Boards

JIS C 6482:1997 Copper-clad laminates for printed wiring boards - Paper base, epoxy resin
JIS R 3410:2006 Glossary Of Terms Relating To Textile Glass
JIS Z 3197:1999 Testing methods for soldering fluxes
JIS C 6472:1995 Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)
JIS C 6485:1997 Copper-clad laminates for printed wiring boards - Paper base, phenolic resin
JIS C 6483:1997 Copper-clad laminates for printed wiring boards - Synthetic fiber fabric base, epoxy resin
JIS C 5014:1994 Multilayer printed wiring boards
JIS C 6486:1996 Thin copper-clad laminates for multilayer printed wiring boards - Glass fabric base, epoxy resin
JIS H 8646:1991 Electroless copper platings
JIS C 6481:1996 Test methods of copper-clad laminates for printed wiring boards
JIS Z 3284:1994 Solder paste

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Hardcopy - English
PDF - English
Hardcopy - Japanese
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