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SEMI M40 : 2014

SEMI M40 : 2014

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

GUIDE FOR MEASUREMENT OF ROUGHNESS OF PLANAR SURFACES ON POLISHED WAFERS

Superseded date

11-17-2023

Published date

01-12-2013

Publisher

Semiconductor Equipment & Materials Institute

Specifies procedures for specifying the measurements to be used in characterizing and reporting roughness of the planar surfaces of polished wafers of silicon, various compound semiconductors, sapphire, and other types of planar wafer materials.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy

SEMI M1 : 2017 SPECIFICATION FOR POLISHED SINGLE CRYSTAL SILICON WAFERS
SEMI M83 : 2013 TEST METHOD FOR DETERMINATION OF DISLOCATION ETCH PIT DENSITY IN MONOCRYSTALS OF 3-5 COMPOUND SEMICONDUCTORS
SEMI 3D16 : 2016 SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING
SEMI M84 : 2014E SPECIFICATIONS FOR POLISHED SINGLE CRYSTAL SILICON WAFERS FOR GALLIUM NITRIDE-ON-SILICON APPLICATIONS
SEMI 3D2 : 2016 SPECIFICATION FOR GLASS CARRIER WAFERS FOR 3DS-IC APPLICATIONS
SEMI HB1 : 2016 SPECIFICATION FOR SAPPHIRE WAFERS INTENDED FOR USE FOR MANUFACTURING HIGH BRIGHTNESS-LIGHT EMITTING DIODE DEVICES

SEMI M20 : 2015 PRACTICE FOR ESTABLISHING A WAFER COORDINATE SYSTEM
SEMI E89 : 2007(R2013) GUIDE FOR MEASUREMENT SYSTEM ANALYSIS (MSA)
SEMI M50 : 2016 TEST METHOD FOR DETERMINING CAPTURE RATE AND FALSE COUNT RATE FOR SURFACE SCANNING INSPECTION SYSTEMS BY THE OVERLAY METHOD

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