Name: SEMI MS9 : 2011
Brand: SEMI

SPECIFICATION FOR HIGH DENSITY PERMANENT CONNECTIONS BETWEEN MICROFLUIDIC DEVICES

Published date

01-12-2013

Publisher

Semiconductor Equipment & Materials Institute

Gives specification for interconnection dimensions and performance requirements for permanent microfluidic interfaces. It also gives guidance for interface design.

DevelopmentNote	Not available for sale from ILI, customer to contact SEMI. (07/2011)
DocumentType	Standard
PublisherName	Semiconductor Equipment & Materials Institute
Status	Current

SEMI MS8 : 2009(R2015)	GUIDE TO EVALUATING HERMETICITY OF MICROELECTROMECHANICAL SYSTEMS (MEMS) PACKAGES
SEMI MS7 : 2008	SPECIFICATION FOR MICROFLUIDIC INTERFACES TO ELECTRONIC DEVICE PACKAGES
SEMI F1 : 2012	SPECIFICATION FOR LEAK INTEGRITY OF HIGH-PURITY GAS PIPING SYSTEMS AND COMPONENTS

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SEMI MS9 : 2011

SPECIFICATION FOR HIGH DENSITY PERMANENT CONNECTIONS BETWEEN MICROFLUIDIC DEVICES

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