Name: SEMI P47 : 2007(R2013)
Brand: SEMI

TEST METHOD FOR EVALUATION OF LINE-EDGE ROUGHNESS AND LINEWIDTH ROUGHNESS

Published date

01-12-2013

Publisher

Semiconductor Equipment & Materials Institute

Describes standard procedures for calculating the indices for the following two kinds of line roughness to characterize materials and processes for fine line pattern fabrication, especially in the integrated circuit manufacturing environment.

DevelopmentNote	Not available for sale from ILI, customer to contact SEMI. (02/2007)
DocumentType	Standard
PublisherName	Semiconductor Equipment & Materials Institute
Status	Current

BS IEC 62899-301-2:2017	Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
14/30317965 DC : 0	BS EN 62903-2 ED.1 - PRINTED ELECTRONICS - EQUIPMENT - CONTACT PRINTING - RIGID MASTER - PART 2: MEASUREMENT METHOD OF PLATE MASTER PATTERN DIMENSION
IEC 62899-301-2:2017	Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension

SEMI P36 : 2008(R2013)	GUIDE FOR MAGNIFICATION REFERENCE FOR CRITICAL DIMENSION MEASUREMENT SCANNING ELECTRON MICROSCOPES (CD-SEM)
SEMI P19 : 1992(R2007)	SPECIFICATION FOR METROLOGY PATTERN CELLS FOR INTEGRATED CIRCUIT MANUFACTURE
SEMI P35 : 2006(R2013)	TERMINOLOGY FOR MICROLITHOGRAPHY METROLOGY

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SEMI P47 : 2007(R2013)

TEST METHOD FOR EVALUATION OF LINE-EDGE ROUGHNESS AND LINEWIDTH ROUGHNESS

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