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SEMI P19 : 1992(R2007)

SEMI P19 : 1992(R2007)

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR METROLOGY PATTERN CELLS FOR INTEGRATED CIRCUIT MANUFACTURE

Published date

01-12-2013

Publisher

Semiconductor Equipment & Materials Institute

Defines many standard test patterns to provide consistent industry wide evaluation and testing of metrology instruments, micropatterning equipment and processes used in integrated circuit manufacturing.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001) Also available in CD-ROM. (06/2007)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

Standards Relationship
SAC GB/T 16878 : 1997 Identical

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SEMI P25 : 1994(R2004) SPECIFICATION FOR MEASURING DEPTH OF FOCUS AND BEST FOCUS
SEMI P28 : 1996(R2007) SPECIFICATION FOR OVERLAY-METROLOGY TEST PATTERNS FOR INTEGRATED-CIRCUIT MANUFACTURE
SEMI P24 : 1994(R2004) CD METROLOGY PROCEDURES
SEMI P43 : 2004(R2011) PHOTOMASK QUALIFICATION TERMINOLOGY
14/30317965 DC : 0 BS EN 62903-2 ED.1 - PRINTED ELECTRONICS - EQUIPMENT - CONTACT PRINTING - RIGID MASTER - PART 2: MEASUREMENT METHOD OF PLATE MASTER PATTERN DIMENSION
IEC 62899-301-2:2017 Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension

SEMI P24 : 1994(R2004) CD METROLOGY PROCEDURES

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