BS EN 165000-3:1996

1 Scope
2 Document information
2.1 Introduction
2.2 Related documents
3 General requirements
3.1 Self-audit checklist and report
3.2 Description of report/company structure
3.3 Approval information
3.4 Summary of testing
3.5 Analytical methods
3.6 Control of procurement sources and incoming
       material
3.7 Environmental control and static handling
3.8 Change notification requirements
3.9 Hybrid design
4 Thick film processing
4.1 Artwork and screen fabrication
4.2 Substrates
4.3 Substrate saw or scribe and break and substrate
       hold drilling
4.4 Thick film pastes and printing
4.5 Drying and firing
4.6 Resistor trimming
4.7 Inspection and test of processing
4.8 Rework
5 Thin film processing
5.1 Artwork and mask fabrication
5.2 Substrates
5.3 Substrate saw or scribe and break and substrate
       hole drilling
5.4 Thin film processing materials and pattern forming
5.5 Drying and stabilization
5.6 Resistor trimming
5.7 Rework
6 Hybrid assembly
6.1 Solder assembly
6.1.1 Kitting
6.1.2 Cleaning
6.1.3 Component placement
6.1.4 Substrate attach
6.1.5 Soldering
6.1.6 Encapsulation
6.1.7 Rework
6.1.8 Marking
6.2 Chip and assembly
6.2.1 Kitting
6.2.2 Cleaning
6.2.3 Component placement
6.2.4 Substrate attach
6.2.5 Wire-bonding
6.2.6 Package seal
6.2.7 Rework
6.2.8 Marking
7 Test and dispatch
7.1 Electrical tests
7.2 Burn-in
7.3 Endurance
7.4 Dry heat (stabilization bake)
7.5 Change of temperature
7.6 Damp heat testing
7.7 Particle impact noise detection
7.8 Fine leak test
7.9 Gross leak test
7.10 Resistance to soldering heat
7.11 Termination robustness
7.12 Acceleration
7.13 Vibration
7.14 Shock
7.15 Dimensions
7.16 Bond-pull testing
7.17 Salt mist
7.18 Flammability
7.19 Solderability
7.20 Resistance to solvents
7.21 Internal visual inspection
7.22 External visual inspection
7.23 Radiographic inspection
7.24 Acceptance to dispatch