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EN 165000-3:1996

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Film and hybrid integrated circuits - Part 3: Self-audit checklist and report for film and hybrid integrated circuit manufacturers

Withdrawn date

01-03-1997

Published date

17-04-1996

1 SCOPE
2 DOCUMENT INFORMATION
  2.1 Introduction and use
  2.2 Related documents
3 GENERAL REQUIREMENTS
  3.1 Report front sheets and authentication
  3.2 Description of report/company structure
  3.3 Approval information
  3.4 Summary of testing
  3.5 Analytical methods
  3.6 Control of procurement sources and incoming material
  3.7 Environmental control and static handling
  3.8 Major change notification
  3.9 Hybrid design
4 THICK FILM PROCESSING
  4.1 Artwork & Screen fabrication
  4.2 Substrates
  4.3 Substrate saw or scribe and break and substrate hole
       drilling
  4.4 Thick film pastes and printing
  4.5 Drying and firing
  4.6 Resistor trimming
  4.7 Inspection and test of processing
  4.8 Rework
5 THIN FILM PROCESSING
  5.1 Artwork and mask fabrication
  5.2 Substrates
  5.3 Substrate saw or scribe and break and substrate hole
       drilling
  5.4 Thin film processing materials and pattern forming
  5.5 Drying and stabilization
  5.6 Resistor trimming
  5.7 Rework
6 HYBRID ASSEMBLY
  6.1 Solder assembly
       6.1.1 Kitting
       6.1.2 Cleaning
       6.1.3 Component placement
       6.1.4 Substrate attach
       6.1.5 Soldering
       6.1.6 Encapsulation
       6.1.7 Rework
       6.1.8 Marking
  6.2 Chip & Wire
       6.2.1 Kitting
       6.2.2 Cleaning
       6.2.3 Component placement
       6.2.4 Substrate attach
       6.2.5 Wirebonding
       6.2.6 Package seal
       6.2.7 Rework
       6.2.8 Marking
7 TEST AND SHIPPING
  7.1 Electrical tests
  7.2 Bum-in
  7.3 Endurance
  7.4 Dry heat (stabilization bake)
  7.5 Change of temperature
  7.6 Damp heat testing
  7.7 Particle impact noise detection
  7.8 Fine leak testing
  7.9 Gross leak testing
  7.10 Resistance to soldering heat
  7.11 Termination robustness
  7.12 Acceleration
  7.13 Vibration
  7.14 Shock
  7.15 Dimensions
  7.16 Bond-pull testing
  7.17 Salt mist
  7.18 Flammability
  7.19 Solderability
  7.20 Resistance to solvents
  7.21 Internal visual inspection
  7.22 External visual inspection
  7.23 Radiographic inspection
  7.24 Acceptance to dispatch

This checklist is intended for the use of a hybrid microcircuit manufacturer's internal assessment team. It will provide the hybrid manufacturer and the ONS with ongoing information on process control demonstrating compliance with EN 165000-1. It is not intended to include Quality System requirements.

Committee
CLC/SR 47A
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Withdrawn

EN 100012 : 1995 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: X-RAY INSPECTION OF ELECTRONIC COMPONENTS
EN 100114-1 : 1996 RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION
CECC 00016 : 1990 BASIC SPECIFICATION - BASIC REQUIREMENTS FOR THE USE OF STATISTICAL PROCESS CONTROL (SPC) IN THE CECC SYSTEM
EN 165000-1:1996 Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure

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