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CENELEC
EN 62047-3 : 2006

EN 62047-3 : 2006

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING

Published date

20-09-2006

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Test piece materials
4 Test piece fabrications
5 Plane shape of test piece
6 Test piece thickness
7 Gauge mark
8 Test
9 Document attached to standard test pieces
Annex A (informative) Test piece
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10[mu]m, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices.

Committee
SR 47
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

I.S. EN 62047-22:2014 SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES
EN 62047-12 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES (IEC 62047-12:2011)
EN 62047-11 : 2013 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR COEFFICIENTS OF LINEAR THERMAL EXPANSION OF FREE-STANDING MATERIALS FOR MICRO-ELECTROMECHANICAL SYSTEMS (IEC 62047-11:2013)
BS EN 62047-22:2014 Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates
CEI EN 62047-12 : 2012 SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES
CEI EN 62047-11 : 2014 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR COEFFICIENTS OF LINEAR THERMAL EXPANSION OF FREE-STANDING MATERIALS FOR MICRO-ELECTROMECHANICAL SYSTEMS
BS EN 62047-11:2013 Semiconductor devices. Micro-electromechanical devices Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
I.S. EN 62047-11:2013 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR COEFFICIENTS OF LINEAR THERMAL EXPANSION OF FREE-STANDING MATERIALS FOR MICRO-ELECTROMECHANICAL SYSTEMS (IEC 62047-11:2013 (EQV))
BS EN 62047-12:2011 Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
BS EN 62047-8:2011 Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
I.S. EN 62047-12:2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES (IEC 62047-12:2011)

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
ISO 17561:2016 Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for elastic moduli of monolithic ceramics at room temperature by sonic resonance

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