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  • IPC J STD 005 : A

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    REQUIREMENTS FOR SOLDERING PASTES

    Available format(s):  Hardcopy

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 GENERAL
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 QUALITY ASSURANCE PROVISIONS
    5 PREPARATION FOR DELIVERY
    6 NOTES
    APPENDIX A - Test Report on Solder Paste

    Abstract - (Show below) - (Hide below)

    Specifies requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes QQ S 571, IPC SP 819, QPL 14256 and QPL QQ S 571. Included in IPC C 103 & IPC C 1000. (07/2009) 1995 Edition is still available in Japanese Language, See J STD 005 JAPANESE. (02/2012) Also available in Russian Language, See J STD 005 RUSSIAN. (11/2012) Also available in Chinese Language, See J STD 005 CHINESE. (03/2013) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

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    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
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    IPC LDFR0605-CD : 2005 IPC/SOLDERTEC 3RD INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONICS "TOWARDS IMPLEMENTATION OF THE ROHS DIRECTIVE"
    IPC LDFR1005-CD : 2005 IPC/JEDEC 11TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES
    IPC 7526 : 2007 STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK
    IPC LDFR1106-CD : 2006 IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND"
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    IPC MI 660 : 1984 INCOMING INSPECTION OF RAW MATERIALS MANUAL
    IPC LDFR0406-CD : 2006 IPC/SOLDERTEC GLOBAL 4TH INTERNATIONAL ELECTRONICS CONFERENCE AND EXHIBITION "ROHS COMPLIANCE AND BEYOND"
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    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
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    MIL-STD-186 Revision F:2002 PROTECTIVE FINISHING SYSTEMS FOR ROCKETS, GUIDED MISSILES, SUPPORT EQUIPMENT AND RELATED MATERIALS
    MIL-DTL-32234 Base Document:2007 CONNECTORS, ELECTRICAL, ULTRA HIGH DENSITY, MODULAR, BLADE AND FORK, EIGHT ROW, GENERAL SPECIFICATION FOR
    MIL-PRF-32560 Base Document:2016 COIL, RADIO FREQUENCY, SURFACE MOUNT, FIXED ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
    SAE AMS P 81728 : 2015 PLATING, TIN-LEAD (ELECTRODEPOSITED)
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    MIL-DTL-39024 Revision C:2014 JACK, TIP (TEST POINT, PANEL OR PRINTED WIRING TYPE), GENERAL SPECIFICATION FOR
    NASA MSFC STD 2904 : 2006 MSFC TAILORING GUIDE FOR NASA-STD-8739.2, WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY
    MIL-STD-981 Revision C:2010 DESIGN, MANUFACTURING AND QUALITY STANDARDS FOR CUSTOM ELECTROMAGNETIC DEVICES FOR SPACE APPLICATIONS
    MIL-B-49030 Revision A:2010 BATTERIES, DRY (ALKALINE)
    NASA KSC SPEC E 0031 : 2008 CABLES, ELECTRICAL, SPECIFICATION FOR
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
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    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    MIL-DTL-5794 Revision C:2006 MICROPHONE UNIT M-6A/UR AND MICROPHONE, CARBON M-51/UR (CARBON NOISE CANCELING)
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    BS EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
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    11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
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    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC A 20/21 : 1996 STANDARD PITCH STENCIL PATTERN FOR SLUMP - GERBER FORMAT
    ISO 9001:2015 Quality management systems — Requirements
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