SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)

Published date

12-01-2013

Publisher

FOREWORD
1 Scope
2 Normative references
3 General
4 Test condition A - Tension
5 Test condition B - Bending stress
6 Test condition C - Lead fatigue
7 Test condition D - Lead torque
8 Test condition E - Stud torque
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

DevelopmentNote	Indice de classement: C96-022-14. PR NF EN 60749-14 June 2002 (08/2002)
DocumentType	Standard
PublisherName	Association Francaise de Normalisation
Status	Current

Standards	Relationship
DIN EN 60749-14:2004-07	Identical
UNE-EN 60749-14:2004	Identical
BS EN 60749-14:2003	Identical
I.S. EN 60749-14:2003	Identical
IEC 60749-14:2003	Identical
EN 60749-14:2003	Identical

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NF EN 60749-14 : 2004

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)

Table of Contents

Abstract

General Product Information

International Equivalents

Category

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