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BS EN 62047-22:2014

BS EN 62047-22:2014

Current

Current

The latest, up-to-date edition.

Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

31-10-2014

Publisher

British Standards Institution

1 Scope
2 Normative references
3 Terms, definitions, symbols
  and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates.

This part of IEC62047 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.

Committee
EPL/47
DocumentType
Standard
Pages
14
PublisherName
British Standards Institution
Status
Current

Standards Relationship
EN 62047-22:2014 Identical
IEC 62047-22:2014 Identical

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
IEC 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
EN 62047-3 : 2006 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
ISO 527-3:1995 Plastics Determination of tensile properties Part 3: Test conditions for films and sheets
EN ISO 527-3:1995/AC:2002 PLASTICS - DETERMINATION OF TENSILE PROPERTIES - PART 3: TEST CONDITIONS FOR FILMS AND SHEETS

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Hardcopy - English
PDF - English
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