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EN 62047-6:2010

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

Superseded date

08-02-2022

Published date

05-03-2010

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test piece
5 Testing method and test apparatus
6 Endurances (test termination)
7 Test report
Annex A (informative) Technical background of
        this standard
Annex B (informative) Test piece
Annex C (informative) Displacement measurement
Annex D (informative) Testing environment
Annex E (informative) Number of test pieces
Bibliography
Annex ZA (normative) Normative references to
         international publications with their
         corresponding European publications

IEC 62047-6:2009 specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, andtest piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.

Committee
CLC/SR 47F
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Superseded
SupersededBy

BS EN 62047-18:2013 Semiconductor devices. Micro-electromechanical devices Bend testing methods of thin film materials
CEI EN 62047-18 : 2014 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS
I.S. EN 62047-18:2013 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS (IEC 62047-18:2013 (EQV))

ASTM E 466 : 2015 : REDLINE Standard Practice for Conducting Force Controlled Constant Amplitude Axial Fatigue Tests of Metallic Materials
ISO 6892:1998 Metallic materials Tensile testing at ambient temperature
IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
ISO 1099:2017 Metallic materials — Fatigue testing — Axial force-controlled method
ISO 12107:2012 Metallic materials — Fatigue testing — Statistical planning and analysis of data

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