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IEC 60749-20:2008
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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EN 62137-1-4:2009
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Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
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EN 61189-5 : 2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
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EN 60191-6-2:2002
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Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
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IEC 60068-1:2013
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Environmental testing - Part 1: General and guidance
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EN 61188-5-8:2008
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Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
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IEC 60068-2-58:2015+AMD1:2017 CSV
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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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EN 60749-20-1 : 2009
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
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IEC 60068-2-27:2008
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Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
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IEC 62137-3:2011
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Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
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EN 62137-3:2012
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Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
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IEC 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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EN 61190-1-1:2002
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Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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IEC 61249-2-7:2002
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Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
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IEC 61188-5-8:2007
|
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
|
|
IEC 60749-1:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 1: General
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|
EN 60068-2-2:2007
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Environmental testing - Part 2-2: Tests - Test B: Dry heat
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|
IEC 60068-2-21:2006
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Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
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EN 60068-1:2014
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Environmental testing - Part 1: General and guidance
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|
EN 61760-1:2006
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SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
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|
IEC 60191-6-5:2001
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Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
|
|
IEC 61760-1:2006
|
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
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|
EN 60749-1:2003
|
Semiconductor devices - Mechanical and climatic test methods - Part 1: General
|
|
IEC 62137-1-3:2008
|
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
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|
EN 61249-2-7:2002/corrigendum:2005
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MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
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|
IEC 62137-1-4:2009
|
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
|
|
EN 61189-3:2008
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
|
|
IEC 61189-5:2006
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Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
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|
EN 60068-2-44:1995
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Environmental testing - Part 2: Tests - Guidance on Test T: Soldering
|
|
EN 60068-2-27:2009
|
Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
|
|
IEC 60191-6-2:2001
|
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
|
|
IEC 61190-1-1:2002
|
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
|
|
IEC 61189-3:2007
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
|
|
EN 60068-2-21:2006
|
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
|
|
IEC 60068-2-2:2007
|
Environmental testing - Part 2-2: Tests - Test B: Dry heat
|
|
IEC 60194:2015
|
Printed board design, manufacture and assembly - Terms and definitions
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|
EN 60068-2-78:2013
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Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
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|
EN 60068-2-6:2008
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Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal)
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|
EN 62137-1-3:2009
|
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
|
|
EN 61249-2-8:2003
|
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
|
|
EN 60749-20:2009
|
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
|
|
EN 61190-1-3:2007/A1:2010
|
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
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|
IEC 60068-2-44:1995
|
Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
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IEC 60068-2-14:2009
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Environmental testing - Part 2-14: Tests - Test N: Change of temperature
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|
EN 61190-1-2:2014
|
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
|
|
IEC 60749-20-1:2009
|
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
|
|
EN 60068-2-14:2009
|
Environmental testing - Part 2-14: Tests - Test N: Change of temperature
|
|
EN 60191-6-5:2001
|
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
|
|
IEC 61249-2-8:2003
|
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
|
|
EN 60194:2006
|
Printed board design, manufacture and assembly - Terms and definitions
|
|
IEC 61190-1-3:2007+AMD1:2010 CSV
|
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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