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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR 1,50 MM, 1,27 MM AND 1,00 MM PITCH BALL AND COLUMN TERMINAL PACKAGES

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2002

Publisher

National Standards Authority of Ireland

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For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Ball terminal packages, 1,50 mm, 1,27 mm and 1,00 mm
  pitch
5 Column terminal packages, 1,50 mm, 1,27 mm and
  1,00 mm pitch
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Gives the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	22
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
UNE-EN 60191-6-2:2003	Identical
BS EN 60191-6-2:2002	Identical
NF EN 60191-6-2 : 2002	Identical
DIN EN 60191-6-2:2002-09	Identical
IEC 60191-6-2:2001	Identical
EN 60191-6-2:2002	Identical