I.S. EN 62878-1-1:2015
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
Hardcopy , PDF
09-01-2020
English
01-01-2015
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Test methods
5 Shipping inspection
Annex A (informative) - Related test methods
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines the test methods of passive and active device embedded substrates.
DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
DocumentType |
Standard
|
Pages |
122
|
PublisherName |
National Standards Authority of Ireland
|
Status |
Superseded
|
Standards | Relationship |
EN 62878-1-1:2015 | Identical |
IEC TS 62878-2-3:2015 | Device embedded substrate - Part 2-3: Guidelines - Design guide |
IEC 61189-11:2013 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
IEC 62421:2007 | Electronics assembly technology - Electronic modules |
IEC TS 62878-2-1:2015 | Device embedded substrate - Part 2-1: Guidelines - General description of technology |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC TS 62878-2-4:2015 | Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG) |
EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
ISO 3366:1999 | Coated abrasives Abrasive rolls |
IEC 62137-1-3:2008 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
ISO 4957:1999 | Tool steels |
IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
IEC 60068-2-64:2008 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance |
IEC 60068-2-53:2010 | Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests |
ISO 15184:2012 | Paints and varnishes Determination of film hardness by pencil test |
IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
ISO 6906:1984 | Vernier callipers reading to 0,02 mm |
ISO 29864:2007 | Self adhesive tapes Measurement of breaking strength and elongation at break |
ISO 9180:1988 | Black leads for wood-cased pencils Classification and diameters |
ISO 6353-3:1987 | Reagents for chemical analysis — Part 3: Specifications — Second series |
IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
ISO 29863:2007 | Self adhesive tapes Measurement of static shear adhesion |
IEC 62137-1-2:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
ISO 29862:2007 | Self adhesive tapes Determination of peel adhesion properties |
ISO 3599:1976 | Vernier callipers reading to 0,1 and 0,05 mm |
IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
ISO 8512-1:1990 | Surface plates — Part 1: Cast iron |
ISO 291:2008 | Plastics Standard atmospheres for conditioning and testing |
IEC 60068-2-80:2005 | Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode |
ISO 3611:2010 | Geometrical product specifications (GPS) — Dimensional measuring equipment: Micrometers for external measurements — Design and metrological characteristics |
ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
ISO 8512-2:1990 | Surface plates — Part 2: Granite |
ISO 21948:2001 | Coated abrasives Plain sheets |
IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
ISO 2409:2013 | Paints and varnishes Cross-cut test |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
ISO 9445-1:2009 | Continuously cold-rolled stainless steel Tolerances on dimensions and form Part 1: Narrow strip and cut lengths |
IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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