NBN EN 60749-30 : 2006 AMD 1 2011
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
12-01-2013
1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
4.1 Moisture chamber
4.2 Solder equipment
4.3 Optical microscope
4.4 Electrical test equipment
4.5 Drying (bake) oven
4.6 Temperature cycle chamber (optional)
5 Procedure
5.1 General
5.2 Initial measurements
5.3 Temperature cycling (optional)
5.4 Drying (bake out)
5.5 Soak conditions for dry-packed SMDs
5.6 Method C for soak conditions for
non-dry-packed SMDs in accordance with
IEC 60749-20
5.7 Solder reflow
5.8 Flux application simulation (optional)
5.9 Final measurements
5.10 Applicable reliability tests
6 Summary
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
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