DIN EN 60749-30:2011-12
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011); German version EN 60749-30:2005 + A1:2011
Hardcopy , PDF
01-02-2023
German
01-12-2011
1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
4.1 Moisture chamber
4.2 Solder equipment
4.3 Optical microscope
4.4 Electrical test equipment
4.5 Drying (bake) oven
4.6 Temperature cycle chamber (optional)
5 Procedure
5.1 General
5.2 Initial measurements
5.3 Temperature cycling (optional)
5.4 Drying (bake out)
5.5 Soak conditions for dry-packed SMDs
5.6 Method C for soak conditions for
non-dry-packed SMDs in accordance with
IEC 60749-20
5.7 Solder reflow
5.8 Flux application simulation (optional)
5.9 Final measurements
5.10 Applicable reliability tests
6 Summary
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Important note : All end users must be registered with an Account prior to user licenses being assigned.Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.