TR NWT 000418 : ISSUE 2

1 INTRODUCTION
1.1 Scope and Purpose
1.2 Changes From Previous Issue
1.2.1 TA-TSY-000418, Issue 2
1.2.2 TA-NWT-000418, Issue 3
1.2.3 Current Document
1.2.4 Future Additions
1.3 Related Bellcore Documents
1.4 Requirements Terminology
1.5 Document Organization
2 SYSTEM RELIABILITY AND SERVICE AVAILABILITY
               CRITERIA
2.1 Reliability Definitions
2.2 Interoffice Applications
2.2.1 Asynchronous Transmission Products
2.2.2 SONET End Terminals and Terminal Multiplexers
2.2.3 SONET Regenerators
2.2.4 SONET Rings and Add/Drop Multiplexers
2.2.5 Digital Cross-Connect Systems with SONET
               Interfaces
2.3 Loop Applications
2.3.1 Feeder Segment
2.4 Additional System Reliability Criteria
2.4.1 System Outage Information
2.4.2 Operations System Interface Availability
2.4.3 Silent Failure Criteria
2.4.4 Memory Backup and Restoration
2.5 Equipment Maintenance
2.5.1 Maintenance Criteria for Interoffice and Feeder
               Applications
2.5.2 Maintenance Criteria for FITL Systems
2.5.3 Required Information on Maintenance Activities
2.6 Infant Mortality Criteria
2.7 Procedures for Calculating Failure Rates of
               Circuit Packs and Modules
2.7.1 Device Quality Factors
2.7.2 Device Stress Factors
2.7.3 Ambient Temperature Factors
2.7.4 Alternative Calculation Techniques
2.8 Procedures for Calculating System Unavailability
               and Related Reliability Parameters
2.8.1 System Reliability Model
2.8.2 Repair Rate Assumptions
2.8.3 Link Loss Budget
2.8.4 Outage Graphs
2.8.5 Other System Documentation
2.8.6 Summary Table of Reliability Parameters
3 SUB-ASSEMBLY AND ENVIRONMENTAL CRITERIA
3.1 Component Reliability Assurance
3.2 Physical Design Criteria
3.3 Environmental Criteria
3.4 Third-Party Equipment
4 TESTING
4.1 Product Life Cycle
4.2 System Qualification
4.2.1 Product Specifications
4.2.2 General Qualification Tests and Parameters
4.2.3 Special Tests
4.2.4 Environmental Tests
4.2.5 Reliability Model Verification
4.2.6 Maintenance Procedures
4.2.7 Qualification Report
4.3 Periodic Requalification Requirements
4.3.1 General Tests
4.3.2 Special Tests
4.3.3 Environmental Tests
4.3.4 Requalification Report
4.3.5 Reliability Model Verification
4.4 Reliability Testing
4.4.1 Test Purpose and Frequency
4.4.2 Test Conditions and Procedure
4.5 First Office Application Qualification
4.6 Manufacturing Tests
4.6.1 Design for Testability
4.6.2 Routine Manufacturing Tests
4.6.3 Data Analysis and Reporting
4.7 Standardized Test Procedures
5 MANUFACTURING AND ASSEMBLY RELIABILITY
5.1 Incoming Lot Controls
5.2 Manufacturing and Assembly Practices
5.2.1 Manufacturing Process Qualification
5.2.2 Technologies
5.2.3 Manufacturing Controls
5.2.4 In-Process Tests and Inspections
5.2.5 Manufacturing Process Requalification
5.2.6 ESD Controls
5.3 Circuit Pack and System Functional Testing
5.4 Corrective Action Program
6 SOFTWARE RELIABILITY (AND QUALITY)
6.1 Definitions
6.2 Design for Reliability and Quality
6.2.1 Fault Detection, Containment, Recovery and
               Reporting
6.2.2 Fault History
6.2.3 Trend Detection
6.2.4 Prevention of Interference
6.2.5 Concurrency
6.2.6 Modularity/Interdependency
6.2.7 High-Level Languages
6.2.8 Design & Architecture Documentation
6.2.9 Database
6.2.10 Data Integrity
6.2.11 Operations Systems (OS) Compatibility
6.2.12 NE Software Release Information
6.3 Firmware
6.3.1 Design Methodology
6.3.2 Firmware/Software Coupling
6.3.3 Stability
6.3.4 Mounting
6.3.5 Classification
6.3.6 Considerations for Update Procedures
6.3.7 Circuit Pack Level Testing
6.3.8 Pass/Fail Indication
6.3.9 Record Administration
6.3.10 Change History
6.3.11 Identification
6.3.12 Downward/Upward Compatibility
6.3.13 Traceability
6.3.14 Spare Circuit Pack Administration
6.3.15 Documentation
6.4 Patching
6.4.1 Patch Monitoring
6.4.2 Patch Assurance
6.4.3 Patch Sequence Numbers and Identification
6.4.4 Patch Propagation to Other Releases
6.4.5 Patch Space
6.4.6 Defective Patches
6.4.7 Writable Firmware Devices
6.4.8 Feature Patching
6.4.9 Patch Information
6.4.10 Patching Tools
6.4.11 Patch Measurements
6.5 Testing
6.5.1 Criteria Common to Test Phases
6.5.2 Module Testing
6.5.3 Functional Unit Testing
6.5.4 Integration Test
6.5.5 System Test
6.5.6 First Office Application (FOA) Testing
6.6 Feature Release Delivery Information
6.6.1 Feature/Release Availability Information
6.6.2 Feature Request Dates
6.6.3 Release Support Period
6.6.4 Dropped or Delayed Features or Releases
6.7 Downtime and Service Impact
6.8 Referenced Software Criteria
6.8.1 Software Quality Program Generic Requirements
6.8.2 Software Reliability and Quality Acceptance
               Requirements
6.8.3 R & Q Measurements for Telecommunications Systems
7 FIELD PERFORMANCE AND CUSTOMER SUPPORT
7.1 Field Performance
7.1.1 Collection and Analysis Program Capabilities
7.1.2 Hardware Performance Tracking
7.1.3 Software Performance Tracking
7.1.4 Product Repair
7.1.5 No Trouble Found (NTF) Circuit Packs
7.1.6 Dead On Arrival (DOA) Circuit Packs
7.1.7 Turnaround Time for Repairs
7.1.8 Engineering Complaints
7.1.9 Corrective Action
7.2 Customer Support
7.2.1 General Documentation and Reporting of Data
7.2.2 Engineering, Ordering and Sparing
7.2.3 Training
7.2.4 Installation
7.2.5 Customer Maintenance
7.2.6 Product Updates
7.2.7 Technical Assistance
8 SUMMARY LISTING OF CRITERIA
9 GLOSSARY OF ACRONYMS
APPENDIX A - Temperature Cycle Endurance Test
A.1 Test Conditions
A.1.1 Temperature Extremes
A.1.2 Soak Time
A.1.3 Ramp Rate
A.1.4 Test Duration
A.1.5 Humidity
A.2 Test Configurations
A.3 Measurements
A.3.1 Measurement Parameters
A.3.2 Frequency of Measurements
A.4 Pass/Failure Criteria
A.5 Example Test Set-Up
APPENDIX B - Example Tables for Reliability Model Verification
APPENDIX C - Overview of Bellcore Sampling Plans
REFERENCES
SUBJECT INDEX