IPC 2223 CHINESE : C

Name: IPC 2223 CHINESE : C
Brand: IPC

Withdrawn

SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS

Withdrawn date

09-14-2023

Publisher

Institute of Printed Circuits

DevelopmentNote	Chinese translation of C2011 Edition issued in October 2014. (02/2015)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Withdrawn

IPC 4202 : A	FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS
IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 2152 : 0	STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN
IPC 4203 : A	COVER AND BONDING MATERIAL FOR FLEXIBLE PRINTED CIRCUITRY
IPC TM 650 : 0	TEST METHODS MANUAL
IPC SM 840 : E	QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC 4101 : D	SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC 2615 : 0	PRINTED BOARD DIMENSIONS AND TOLERANCES
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2222 : A	SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC 4204 : A	FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
IPC 4562 : A	METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC HDBK 840 : 0	SOLDER MASK HANDBOOK

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