• There are no items in your cart

SEMI E10 : 2014E

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SPECIFICATION FOR DEFINITION AND MEASUREMENT OF EQUIPMENT RELIABILITY, AVAILABILITY, AND MAINTAINABILITY (RAM) AND UTILIZATION

Superseded date

03-08-2021

Published date

01-12-2013

Sets up a common basis for communication between users and suppliers of semiconductor manufacturing equipment by providing a standardized methodology for measuring reliability, availability, and maintainability (RAM) and utilization performance of equipment in a manufacturing environment.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001) E = This standard was editorially modified in November 2015 to correct editorial errors. (12/2015)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy

SEMI E81 : 2000(R2007) PROVISIONAL SPECIFICATION FOR CIM FRAMEWORK DOMAIN ARCHITECTURE
SEMI E58 : JUL 2003 AUTOMATED RELIABILITY, AVAILABILITY, AND MAINTAINABILITY STANDARD (ARAMS): CONCEPTS, BEHAVIOR, AND SERVICES
SEMI E116 : 2017 SPECIFICATION FOR EQUIPMENT PERFORMANCE TRACKING
SEMI E104 : 2003 SPECIFICATION FOR INTEGRATION AND GUIDELINE FOR CALIBRATION OF LOW-PRESSURE PARTICLE MONITOR
SEMI S23 : 2016 GUIDE FOR CONSERVATION OF ENERGY, UTILITIES AND MATERIALS USED BY SEMICONDUCTOR MANUFACTURING EQUIPMENT
SEMI E106 : 2004 OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSICAL INTERFACES AND CARRIERS FOR 300 MM WAFERS
SEMI E79 : 2014E SPECIFICATION FOR DEFINITION AND MEASUREMENT OF EQUIPMENT PRODUCTIVITY
SEMI E97 : 2000A(R2007) PROVISIONAL SPECIFICATION FOR CIM FRAMEWORK GLOBAL DECLARATIONS AND ABSTRACT INTERFACES
SEMI E98 : 2009 PROVISIONAL STANDARD FOR THE OBJECT-BASED EQUIPMENT MODEL (OBEM)
SEMI G78 : 1999 TEST METHOD FOR COMPARING AUTOMATED WAFER PROBE SYSTEMS UTILIZING PROCESS-SPECIFIC MEASUREMENTS
SEMI E149 : 2014 GUIDE FOR EQUIPMENT SUPPLIER-PROVIDED DOCUMENTATION FOR THE ACQUISITION AND USE OF MANUFACTURING EQUIPMENT
SEMI E124 : 2007(R2013) GUIDE FOR DEFINITION AND CALCULATION OF OVERALL FACTORY EFFICIENCY (OFE) AND OTHER ASSOCIATED FACTORY-LEVEL PRODUCTIVITY METRICS
SEMI PV2 : 2009E GUIDE FOR PV EQUIPMENT COMMUNICATION INTERFACES (PVECI)
SEMI S14 : 2016 SAFETY GUIDELINES FOR FIRE RISK ASSESSMENT AND MITIGATION FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
SEMI E70 : 2013 GUIDE FOR TOOL ACCOMMODATION PROCESS
SEMI E35 : 2012 GUIDE TO CALCULATE COST OF OWNERSHIP (COO) METRICS FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
IEEE 1100 : 2005 POWERING AND GROUNDING ELECTRONIC EQUIPMENT
SEMI E150 : 2014 GUIDE FOR EQUIPMENT TRAINING BEST PRACTICES
SEMI M49 : 2016 GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 16 NM TECHNOLOGY GENERATIONS
SEMI P24 : 1994(R2004) CD METROLOGY PROCEDURES
SEMI M52 : 2014 GUIDE FOR SPECIFYING SCANNING SURFACE INSPECTION SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 11 NM TECHNOLOGY GENERATIONS
SEMI E113 : 2006(R2018) SPECIFICATION FOR SEMICONDUCTOR PROCESSING EQUIPMENT RF POWER DELIVERY SYSTEMS
SEMI E30.2 : 1998 HANDLER EQUIPMENT SPECIFIC EQUIPMENT MODEL (HSEM)

SEMI E116 : 2017 SPECIFICATION FOR EQUIPMENT PERFORMANCE TRACKING
SEMI E35 : 2012 GUIDE TO CALCULATE COST OF OWNERSHIP (COO) METRICS FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
SEMI E79 : 2014E SPECIFICATION FOR DEFINITION AND MEASUREMENT OF EQUIPMENT PRODUCTIVITY
SEMI E58 : JUL 2003 AUTOMATED RELIABILITY, AVAILABILITY, AND MAINTAINABILITY STANDARD (ARAMS): CONCEPTS, BEHAVIOR, AND SERVICES

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.