BS 9450:1975

Cooperating organizations
Specification
0. Introduction
Section one. Principles and mandatory requirements
1.1 General matters
1.1.1 Scope
1.1.2 Related documents
1.1.3 Terminology
1.1.3.1 General terms
1.1.3.2 Integrated circuits and their functions
1.1.3.3 General descriptive terms
1.1.3.4 Terms for the characteristics of digital
          circuits
1.1.3.5 Terms for the characteristics of analogue
          circuits
1.1.4 Letter symbols, signs and abbreviations
1.1.4.1 Digital circuits
1.1.5 Graphical symbols
1.1.6 Marking of the component and package
1.1.6.1 Terminal identification
1.1.6.2 Customer's type number (or colour code)
1.1.6.3 Factory identification code or manufacturer's
          name or trade mark
1.1.6.4 Date code
1.1.6.5 Text deleted
1.1.6.6 Detail specification number
1.1.6.7 Colour code identification for type number
1.1.7 Eligibility for release
1.1.7.1 Film and hybrid integrated circuits, micro-
          assemblies, micro-modules and microwave
          integrated circuits
1.1.7.2 Monolithic and multichip semiconductor
          circuits
1.1.7.3 Use of non-approved sub-contractors
1.1.8 Structural similarity
1.1.9 Delayed delivery
1.1.10 Supplementary procedure for qualification
          approval
1.1.11 Certified test records
1.1.12 Standard ratings and characteristics
1.1.12.1 Supply terminal voltages
1.1.12.2 Test temperatures
1.1.12.3 Preferred temperature ranges
1.1.13 Unchecked parameters
1.1.14 Procedure to be followed in the event of
          failure at groups C and D inspection
1.1.15 Ordering information
1.1.16 Release prior to completion of group B tests
1.1.17 Supplementary procedure for reduced
          inspection
1.1.18 Supplementary procedure for general
          application category components
1.1.19 Rework
1.2 Test procedures
1.2.1 Standard conditions for testing
1.2.1.1 General
1.2.1.2 Safety aspects
1.2.1.3 Drying
1.2.2 External visual inspection
1.2.3 Dimensioning and gauging procedures
1.2.4 Electrical test procedures
1.2.4.1 General
1.2.4.2 Measurement methods
1.2.5 Mechanical test procedures
1.2.5.1 Direction of acceleration/force
1.2.6 Environmental test procedures
1.2.6.1 Cold
1.2.6.2 Dry heat
1.2.6.3 High temperature storage
1.2.6.4 Damp heat, steady state
1.2.6.5 Damp heat, accelerated/cyclic
1.2.6.6 Shock
1.2.6.7 Bump
1.2.6.8 Vibration (sinusoidal)
1.2.6.9 Acceleration steady state
1.2.6.10 Mould growth
1.2.6.11 Corrosion
1.2.6.12 Low air pressure
1.2.6.13 Rapid change of temperature
1.2.6.14 Sealing
1.2.6.15 Soldering
1.2.6.16 Robustness of terminations
1.2.6.17 Flammability
1.2.6.18 Immersion in cleaning solvents
1.2.6.19 Rapid change of temperature, two-bath method
1.2.6.20 Text deleted
1.2.6.21 Damp heat steady state with bias
1.2.6.22 Thermal intermittance test
1.2.7 Electrical endurance test procedures
1.2.7.1 General
1.2.7.2 Test conditions
1.2.7.3 Specified conditions
1.2.8 Accelerated test procedures
1.2.8.1 Thermally accelerated test for thick film
          resistive elements and associated conductors
1.2.8.2 Damp heat accelerated test for long term
          changes in resistance and interconductor
          leakage
1.2.9 Screening test procedures
1.2.9.0 Introduction
1.2.9.1 Screening requirements
1.2.9.2 Burn-in screen
1.2.10 Internal visual inspection
1.2.10.0 Introduction
1.2.10.1 Pre-assembly inspection
1.2.10.2 Post-assembly inspection
1.2.11 Measurement of conductor adhesion to substrate
1.2.11.1 Pull test
1.2.11.2 Peel test
1.3 Capability approval and maintenance procedures
1.3.1 Capability assessment
1.3.2 Description of capability: Capability manual
1.3.3 Programme for initial capability approval
          and extensions
1.3.4 Performance of capability approval programme
1.3.5 Abstract of description of capability
1.3.6 Maintenance of capability approval
1.3.6.1 Small production lots
1.3.6.2 Capability qualifying circuits
1.3.6.3 Inspection requirements for maintenance of
          capability
1.3.7 Capability approval report
1.3.8 Review, suspension and withdrawal of
          capability approval
1.3.8.1 Review of approval
          Text deleted
1.4 Inspection to the customer's detail
          specification
Section two. Guidance on the preparation of customers'
detail specifications
2.1 Basic information
2.1.1 Originator of the detail specification
2.1.2 Numbering of the detail specification
2.1.3 Description of the circuit and its intended
          application
2.1.4 Outline drawing and dimensions
2.1.5 Limiting conditions of use (ratings)
2.1.6 Required conditions of use and associated
          characteristics
2.1.7 Related documents
2.1.8 Additional information
2.1.9 Ordering instructions
2.2 Quality conformance inspection requirements
2.2.1 Screening requirements
2.2.2 Post-sealing test requirements
2.2.3 Electrical endurance tests
2.2.4 Electrical performance tests
2.2.5 Environmental tests
2.3 Certified test records
2.4 Authentication
Section three. Manufacturer's guidance to customers
3.1 Introduction
3.2 Circuit technology
3.3 Materials, construction and packages
3.4 Policy and information on design data and
          layout rules
3.4.1 Circuit elements
3.4.1.1 Resistors
3.4.1.2 Capacitors
3.4.1.3 Diodes
3.4.1.4 Transistors
3.4.2 Substrates for film circuits
3.4.3 Interconnection tracks and bonding pads
3.4.4 Circuit layout
3.4.5 Art work
3.4.6 Mask and screen preparation
3.4.7 Substrate preparation
3.5 Quality conformance inspection schedules
3.5.1 Pre-assembly inspection
3.5.2 Post-assembly inspection
3.5.3 Post-sealing inspection (environmental)
3.5.4 Electrical endurance inspection
3.5.5 Electrical performance inspection
3.6 Screening options
3.6 Add-on components
3.8 Capability qualifying circuits
3.9 Guidance on the ratings and characteristics
          which the customer should specify
Appendix
A. Guide to the writing of a customer's detail
     specification for a hybrid circuit