SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 21: TEST METHOD FOR POISSON'S RATIO OF THIN FILM MEMS MATERIALS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2016

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions, symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Measurement example of Poisson's
        ratio using type 1 test piece
Annex B (informative) - Analysis of test results obtained from
        a type 2 test piece
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Defines the determination of Poisson's ratio from the test results obtained by the application of uniaxial and biaxial loads to thin-film micro-electromechanical systems (MEMS) materials with lengths and widths less than 10 mm and thicknesses less than 10 [mu]m.

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-130. (06/2016)
DocumentType	Standard
Pages	22
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
EN 62047-21:2014	Identical
IEC 62047-21:2014	Identical

ASTM E 132 : 2017 : REDLINE	Standard Test Method for Poisson’s Ratio at Room Temperature
IEC 62047-8:2011	Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
EN 62047-8:2011	Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

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CEI EN 62047-21 : 2016

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 21: TEST METHOD FOR POISSON'S RATIO OF THIN FILM MEMS MATERIALS

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