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CENELEC
EN 62047-21:2014

EN 62047-21:2014

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

Published date

26-09-2014

Publisher

European Committee for Standards - Electrical

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions, symbols
  and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Measurement example
        of Poisson's ratio using type 1 test piece
Annex B (informative) - Analysis of test results
        obtained from a type 2 test piece
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC 62047-21:2014 specifies the determination of Poisson's ratio from the test results obtained by the application of uniaxial and biaxial loads to thin-film micro-electromechanical systems (MEMS) materials with lengths and widths less than 10 mm and thicknesses less than 10 µm.

Committee
CLC/SR 47F
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

BS EN 62047-16:2015 Semiconductor devices. Micro-electromechanical devices Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection methods
CEI EN 62047-16 : 2016 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS
EN 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
I.S. EN 62047-16:2015 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS - WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS

ASTM E 132 : 2017 : REDLINE Standard Test Method for Poisson’s Ratio at Room Temperature
IEC 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

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