Semiconductor devices - Mechanical and climatic test methods - Part 1: General

Published date

20-06-2003

Publisher

European Committee for Standards - Electrical

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and letter symbols
4 Standard atmospheric conditions
5 Electrical measurements
6 Use of electrically defective devices

Applicable to semiconductor devices (discrete devices and integrated circuits) and establishes provisions common to all the other parts of the series.

Committee	CLC/SR 47
DevelopmentNote	Supersedes EN 60749 (07/2003)
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current
Supersedes	EN 60749 : 99 AMD 2 2001

Standards	Relationship
IEC 60749-1:2002	Identical
NF EN 60749-1 : 2003	Identical
UNE-EN 60749-1:2004	Identical
NBN EN 60749-1 : 2004	Identical
NEN EN IEC 60749-1 : 2003	Identical
I.S. EN 60749-1:2003	Identical
PN EN 60749-1 : 2005	Identical
SN EN 60749-1 : 2003	Identical
BS EN 60749-1:2003	Identical
CEI EN 60749-1 : 2005	Identical
DIN EN 60749-1:2003-12	Identical

BS EN 61747-1:2000	Liquid crystal and solid-state display devices Generic specification
BS EN 62137-4:2014	Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
EN 62137-4:2014/AC:2015	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)