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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2007

Publisher

National Standards Authority of Ireland

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For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 PQFP (square)
  4.1 Field of application
  4.2 Component descriptions
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 PQFP (rectangular)
  5.1 Field of application
  5.2 Component descriptions
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
6 PLQFP (square)
  6.1 Field of application
  6.2 Component descriptions
  6.3 Component dimensions
  6.4 Solder joint fillet design
  6.5 Land pattern dimensions
7 PLQFP (rectangular)
  7.1 Field of application
  7.2 Component descriptions
  7.3 Component dimensions
  7.4 Solder joint fillet design
  7.5 Land pattern dimensions
8 PTQFP (square)
  8.1 Field of application
  8.2 Component descriptions
  8.3 Component dimensions
  8.4 Solder joint fillet design
  8.5 Land pattern dimensions
Annex ZA (normative) - Normative references to international
                       publications with their corresponding
                       European publications
Bibliography

Gives information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	54
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
IEC 61188-5-5:2007	Identical
BS EN 61188-5-5:2007	Identical
NF EN 61188-5-5 : 2016	Identical
EN 61188-5-5:2007	Identical
DIN EN 61188-5-5:2008-07	Identical

IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 60068-2-54:2006	Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

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I.S. EN 61188-5-5:2007

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory