Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

11-07-2007

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
   5.1 Flow soldering equipment
   5.2 Reflow soldering equipment
   5.3 Pull strength test equipment
   5.4 Optical microscope
   5.5 Test substrate
   5.6 Solder alloy
   5.7 Flux for flow soldering
   5.8 Solder paste
6 Mounting method
   6.1 Flow soldering
   6.2 Reflow soldering
7 Test conditions
   7.1 Test: Rapid change of temperature
   7.2 Pull strength test
8 Test procedure
   8.1 Test sequence
   8.2 Pre-conditioning
   8.3 Initial pull strength measurement
   8.4 Rapid change of temperature
   8.5 Recovery
   8.6 Intermediate/final pull strength measurement
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) Pull strength test - Details
Bibliography

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Committee	TC 91
DevelopmentNote	A Bilingual edition has been published. (05/2008) Stability Date: 2020. (09/2017)
DocumentType	Standard
Pages	15
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
JIS C 62137-1-1:2010	Identical
NF EN 62137-1-1 : 2014	Identical
NEN EN IEC 62137-1-1 : 2007	Identical
I.S. EN 62137-1-1:2007	Identical
PN EN 62137-1-1 : 2008	Identical
UNE-EN 62137-1-1:2007	Identical
BS EN 62137-1-1:2007	Identical
CEI EN 62137-1-1 : 2008	Identical
EN 62137-1-1 : 2007	Identical
DIN EN 62137-1-1:2008-02	Identical

BS EN 62137-3:2012	Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
BS ISO 16525-7:2014	Adhesives. Test methods for isotropic electrically conductive adhesives Environmental test methods
NF EN 62137-3 : 2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
ISO 16525-7:2014	Adhesives Test methods for isotropic electrically conductive adhesives Part 7: Environmental test methods
12/30254691 DC : DRAFT MAR 2012	BS ISO 16525-7 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 7: ENVIRONMENTAL TEST METHODS
09/30206176 DC : DRAFT JUNE 2009	BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
IEC PAS 62137-3:2008	Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
DD IEC PAS 62137-3 : DRAFT 2008	ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
IEC 62137-3:2011	Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
CEI EN 62137-3 : 2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
I.S. EN 62137-3:2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV))
EN 62137-3:2012	Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002	Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 60068-2-21:2006	Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 61188-5-5:2007	Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
IEC 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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IEC 62137-1-1:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

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Subcategory