EN 60191-6-8:2001
Current
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
Published date
22-10-2001
FOREWORD
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications
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