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CENELEC
EN 60286-3:2013/AC:2013

EN 60286-3:2013/AC:2013

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)

Superseded date

31-01-2022

Published date

12-01-2013

Publisher

European Committee for Standards - Electrical

FOREWORD
INTRODUCTION
1 General
2 Terms and definitions
3 Structure of the specification
4 Dimensional requirements for taping
5 Polarity and orientation requirements of components in the
   tape
6 Carrier tape requirements
7 Cover tape requirements (for type 1a, 1b, 2a, 2b and 3)
8 Component taping and additional tape requirements
9 Reel requirements
10 Tape reeling requirements
Annex A (normative) - Recommended measuring methods for
        type 1b
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Pertains to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits.

Committee
SR 40
DevelopmentNote
Supersedes HD 143.3. (03/2004) Supersedes EN 60286-3-1 & EN 60286-3-2. (11/2013)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Superseded
SupersededBy
Supersedes

I.S. EN 61188-5-2:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
BS EN 61760-2:2007 Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide
CEI EN 61760-2 : 2008 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
I.S. EN 140402-801:2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
EN 140402-801:2015 Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2
EN 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
EN 140401:2009 Blank Detail Specification: Fixed low power film surface mount (SMD) resistors
EN 140402:2015/A1:2016 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
PD CLC/TR 62258-3:2007 Semiconductor die products Recommendations for good practice in handling, packing and storage
BS EN 61188-5-4:2007 Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
BS EN 60115-8-1:2015 Fixed resistors for use in electronic equipment Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
BS EN 60286-3-1:2009 Packaging of components for automatic handling Packaging of surface mount components on continuous tapes. Type V. Pressed carrier tapes
I.S. EN 140402:2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
CEI EN 61760-1 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
I.S. EN 60115-8-1:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
I.S. EN 60115-8:2012 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD))
I.S. EN 140401:2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
I.S. EN 60393-6:2016 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 6: SECTIONAL SPECIFICATION - SURFACE MOUNT PRESET POTENTIOMETERS
I.S. EN 61188-5-4:2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
EN 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
OVE/ONORM EN 61760-1 : 2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
I.S. CLC/TR 62258-3:2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
BS EN 60393-6:2016 Potentiometers for use in electronic equipment Sectional specification. Surface mount preset potentiometers
CEI EN 60115-8-1 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
BS EN 140401-801 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
BS EN 140401-803 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
I.S. EN 60384-3-1:2007 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3-1: BLANK DETAIL SPECIFICATION: SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH MANGANESE DIOXIDE SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
BS EN 61760-1:2006 Surface mounting technology Standard method for the specification of surface mounting components (SMDs)
BS EN 61760-3:2010 Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering
06/30155905 DC : DRAFT SEP 2006 BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
BS EN 60286-3-2:2009 Packaging of components for automatic handling Packaging of surface mount components on continuous tapes. Type VI. Blister carrier tapes of 4 mm width
I.S. EN 140401-804:2011 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
BS EN 140402 : 2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
BS EN 140401:2009 Blank Detail Specification. Fixed low power film surface mount (SMD) resistors
BS EN 140401-804 : 2011 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
EN 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
EN 140401-804:2011/A1:2013 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
OVE/ONORM EN 61760-2 : 2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
10/30237986 DC : 0 BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
08/30186808 DC : DRAFT JULY 2008 BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS
BS EN 140401-802 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
CEI EN 60384-3-1 : 2007 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3-1: BLANK DETAIL SPECIFICATION: SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH MANGANESE DIOXIDE SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
I.S. EN 61760-3:2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
EN 140401-802:2007/A3:2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
I.S. EN 140401-803:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
I.S. EN 140401-802:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
BS EN 140402-801:2015 Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2
CEI EN 140401 : 2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
CEI EN 60115-8 : 2013 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
BS EN 60384-3-1:2006 Fixed capacitors for use in electronic equipment Blank detail specification: surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte. Assessment level EZ
06/30155911 DC : DRAFT SEP 2006 BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
05/30129971 DC : DRAFT FEB 2005 EN 140402-801 - DETAIL SPECIFICATION - FIXED LOW POWER WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
I.S. EN 60286-3-1:2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-1: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 5 - PRESSED CARRIER TAPES
I.S. EN 60286-3-2:2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-2: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 6 - BLISTER CARRIER TAPES OF 4 MM WIDTH
CEI CLC/TR 62258-3 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
CEI EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
I.S. EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
I.S. EN 140401-801:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
I.S. EN 61760-2:2007 SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
EN 140401-803 : 2007 AMD 3 2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
EN 140401-801:2007/A1:2013 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
BS EN 61188-5-2:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
EN 60384-3-1:2006/corrigendum:2009 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 3-1: BLANK DETAIL SPECIFICATION: SURFACE MOUNT FIXED TANTALUM ELECTROLYTIC CAPACITORS WITH MANGANESE DIOXIDE SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
EN 60393-6:2016 Potentiometers for use in electronic equipment - Part 6: Sectional specification - Surface mount preset potentiometers
EN 60115-8:2012 Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
EN 60115-8-1:2015 Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
EN 61188-5-4 : 2007 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
EN 60286-3-2 : 2009 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3-2: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES - TYPE 6 - BLISTER CARRIER TAPES OF 4 MM WIDTH

IEC 60286-3-2:2009 Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width
IEC 60286-3-1:2009 Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes
EN 61340-5-1:2016/AC:2017-05 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
ISO 11469:2016 Plastics — Generic identification and marking of plastics products
IEC TR 61340-5-2:2007 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
CLC/TR 61340-5-2:2008 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage

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