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SEMI M49 : 2016

SEMI M49 : 2016

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 16 NM TECHNOLOGY GENERATIONS

Superseded date

06-11-2016

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Specifies recommendations for specifying measurement systems for geometry and flatness of silicon wafers of the 130, 90, 65, 45, 32, 22, and 16 nm technology generation as anticipated by the International Technology Roadmap for Semiconductors (ITRS) and in the forecasts of the major manufacturers of semiconductor devices.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (11/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy

SEMI M70 : 2015 TEST METHOD FOR DETERMINING WAFER-NEAR-EDGE GEOMETRY USING PARTIAL WAFER SITE FLATNESS
SEMI M1 : 2017 SPECIFICATION FOR POLISHED SINGLE CRYSTAL SILICON WAFERS
SEMI 3D4 : 2015 GUIDE FOR METROLOGY FOR MEASURING THICKNESS, TOTAL THICKNESS VARIATION (TTV), BOW, WARP/SORI, AND FLATNESS OF BONDED WAFER STACKS
SEMI M78 : 2010 GUIDE FOR DETERMINING NANOTOPOGRAPHY OF UNPATTERNED SILICON WAFERS FOR THE 130 NM TO 22 NM GENERATIONS IN HIGH VOLUME MANUFACTURING

SEMI MF84:2012 TEST METHOD FOR MEASURING RESISTIVITY OF SILICON WAFERS WITH AN IN-LINE FOUR-POINT PROBE
SEMI E10 : 2014E SPECIFICATION FOR DEFINITION AND MEASUREMENT OF EQUIPMENT RELIABILITY, AVAILABILITY, AND MAINTAINABILITY (RAM) AND UTILIZATION
SEMI E159 : 2014 MECHANICAL SPECIFICATION FOR MULTI APPLICATION CARRIER (MAC) USED TO TRANSPORT AND SHIP 450 MM WAFERS
SEMI E1-9 : NOV 2006E MECHANICAL SPECIFICATION FOR CASSETTES USED TO TRANSPORT AND STORE 300 MM WAFERS
SEMI E19 : APR 2017 SPECIFICATION FOR STANDARD MECHANICAL INTERFACE (SMIF)
SEMI M59 : 2014 TERMINOLOGY FOR SILICON TECHNOLOGY
SEMI MF42 : 2016 TEST METHOD FOR CONDUCTIVITY TYPE OF EXTRINSIC SEMICONDUCTING MATERIALS
SEMI MF928 : 2017 TEST METHOD FOR EDGE CONTOUR OF CIRCULAR SEMICONDUCTOR WAFERS AND RIGID DISK SUBSTRATES
SEMI MF1530 : 2007(R2018) TEST METHOD FOR MEASURING FLATNESS, THICKNESS, AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING
SEMI MF534 : 2007 TEST METHOD FOR BOW OF SILICON WAFERS
SEMI E89 : 2007(R2013) GUIDE FOR MEASUREMENT SYSTEM ANALYSIS (MSA)
SEMI MF1451:2007(R2019) TEST METHOD FOR MEASURING SORI ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING
SEMI MF2074 : 2012 (R2018) GUIDE FOR MEASURING DIAMETER OF SILICON AND OTHER SEMICONDUCTOR WAFERS
SEMI M31 : 2008 MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS
SEMI M24 : 2007 SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON PREMIUM WAFERS
SEMI E158 : 2014 MECHANICAL SPECIFICATION FOR FAB WAFER CARRIER USED TO TRANSPORT AND STORE 450 MM WAFERS (450 FOUP) AND KINEMATIC COUPLING
SEMI MF1152 : 2016 TEST METHOD FOR DIMENSIONS OF NOTCHES ON SILICON WAFERS
SEMI M67 : 2015 TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED THICKNESS DATA ARRAY USING THE ESFQR, ESFQD, AND ESBIR METRICS
SEMI M8 : 2012 SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON TEST WAFERS
SEMI MF673 : 2017 TEST METHOD FOR MEASURING RESISTIVITY OF SEMICONDUCTOR WAFERS OR SHEET RESISTANCE OF SEMICONDUCTOR FILMS WITH A NONCONTACT EDDY-CURRENT GAUGE
SEMI E37 : 2013 HIGH-SPEED SECS MESSAGE SERVICES (HSMS) GENERIC SERVICES
SEMI MF657 : 2007E TEST METHOD FOR MEASURING WARP AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY NONCONTRAST SCANNING
SEMI E47.1 : NOV 2006 MECHANICAL SPECIFICATION FOR FOUPS USED TO TRANSPORT AND STORE 300 MM WAFERS
SEMI M62 : 2017 SPECIFICATIONS FOR SILICON EPITAXIAL WAFERS
SEMI M80 : 2016 SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 450 MM WAFERS
SEMI E47 : 2001(R2006) SPECIFICATION FOR 150 MM/200 MM POD HANDLES
SEMI T7 : 2016 SPECIFICATION FOR BACK SURFACE MARKING OF DOUBLE-SIDE POLISHED WAFERS WITH A TWO-DIMENSIONAL MATRIX CODE SYMBOL
SEMI M38 : 2012(R2018) SPECIFICATION FOR POLISHED RECLAIMED SILICON WAFERS
SEMI M73 : 2013 TEST METHODS FOR EXTRACTING RELEVANT CHARACTERISTICS FROM MEASURED WAFER EDGE PROFILES
SEMI E58 : JUL 2003 AUTOMATED RELIABILITY, AVAILABILITY, AND MAINTAINABILITY STANDARD (ARAMS): CONCEPTS, BEHAVIOR, AND SERVICES
SEMI M68 : MAR 2015 TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED HEIGHT DATA ARRAY USING A CURVATURE METRIC, ZDD
SEMI MF671:2012 TEST METHOD FOR MEASURING FLAT LENGTH ON WAFERS OF SILICON AND OTHER ELECTRONIC MATERIALS

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