IPC J STD 001 GERMAN : F

Superseded

View Superseded by

REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

Available format(s)

Hardcopy

Superseded date

01-28-2018

Language(s)

German

Publisher

Institute of Printed Circuits

Diese Richtlinie schreibt Verfahren und Anforderungskriterien für die Herstellung gelöteter elektrischer und elektronischer Baugruppen vor. In der Vergangenheit enthielten Richtlinien für elektronische Baugruppen (Lötverfahren) umfassendere Anleitungen (Tutorials) hinsichtlich Grundlagen und Techniken. Um die Empfehlungen und Forderungen dieses Dokumentes besser zu verstehen, kann es ggf. in Verbindung mit IPC-HDBK-001, IPC-A-610 und IPC-HDBK-610 verwendet werden.

DevelopmentNote	German translation of F2014 Edition issued in January 2015. (04/2015) Also available in Hardcopy format. (01/2018)
DocumentType	Standard
Pages	88
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC J STD 001 : F
Supersedes	IPC J STD 001 GERMAN : E

IPC A 600 : H	ACCEPTABILITY OF PRINTED BOARDS
IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 6011 : 0	GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
IPC CC 830 : B	QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
IPC 7093 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IPC J STD 006 : C	REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 004 : B	REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0	TEST METHODS MANUAL
IPC HDBK 001 : E	HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
IPC J STD 033C-1:2014	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IPC A 610 : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 005 : A	REQUIREMENTS FOR SOLDERING PASTES
IPC 7530 : 0	GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)
IPC J STD 002 : D	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
ESD S20.20 : 2014	PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 9691 : A	USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
IPC D 279 : 0	DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 7711/21 : B	REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC 9201 : A	SURFACE INSULATION RESISTANCE HANDBOOK
IPC 9701 : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC OI 645 : 0	STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
IPC J STD 075 : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
IPC J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC SM 817 : A	GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
IPC 6013 : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
IPC 9202 : 0	MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE
IPC 9203 : 0	USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE
IPC 9261 : A	IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS
IPC 2223 : C	SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC 9191 : 0	GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
IPC SM 785 : 0	GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
IPC 6012 : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC AJ 820 : A	ASSEMBLY AND JOINING HANDBOOK