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  • 13/30264600 DC : 0

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    BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date: 

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Terms, definitions and symbols
    4 Measuring method
    Bibliography

    General Product Information - (Show below) - (Hide below)

    Comment Closes On
    Committee EPL/47
    Document Type Draft
    Publisher British Standards Institution
    Status NA

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    IEC 60749-17:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 17: NEUTRON IRRADIATION
    IEC 60068-2-5:2010 Environmental testing - Part 2-5: Tests - Test Sa: Simulated solar radiation at ground level and guidance for solar radiation testing
    IEC 60068-2-70:1995 Environmental testing - Part 2-70: Tests - Test Xb: Abrasion of markings and letterings caused by rubbing of fingers and hands
    IEC 60068-2-18:2017 Environmental testing - Part 2-18: Tests - Test R and guidance: Water
    IEC 60068-2-43:2003 ENVIRONMENTAL TESTING - PART 2-43: TESTS - TEST KD: HYDROGEN SULPHIDE TEST FOR CONTACTS AND CONNECTIONS
    IEC 60068-2-68:1994 Environmental testing - Part 2-68: Tests - Test L: Dust and sand
    IEC 60749-8:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 8: SEALING
    IEC 60749-21:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
    IEC 60749-25:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING
    IEC 60749-30:2005+AMD1:2011 CSV SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 60749-5:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
    IEC 60068-2-60:2015 RLV Environmental testing - Part 2-60: Tests - Test Ke: Flowing mixed gas corrosion test
    IEC 60068-2-63:1991 Environmental testing - Part 2: Test methods - Test Eg: Impact, spring hammer.
    IEC 60068-2-49:1983 ENVIRONMENTAL TESTING - GUIDANCE TO TEST KC: SULFUR DIOXIDE TEST FOR CONTACTS AND CONNECTIONS
    IEC 60068-2-81:2003 Environmental testing - Part 2-81: Tests - Test Ei: Shock - Shock response spectrum synthesis
    IEC 60749-4:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
    IEC 60749-31:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 31: FLAMMABILITY OF PLASTIC-ENCAPSULATED DEVICES (INTERNALLY INDUCED)
    IEC 60749-1:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 1: GENERAL
    IEC 60749-29:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60068-2-13:1983 ENVIRONMENTAL TESTING - PART 2: TESTS - TEST M: LOW AIR PRESSURE
    IEC 60068-2-57:2013 Environmental testing - Part 2-57: Tests - Test Ff: Vibration - Time-history and sine-beat method
    IEC 60068-2-50 : 1.0 ENVIRONMENTAL TESTING - TESTS Z AFc: COMBINED COLD VIBRATION (SINUSOIDAL) TESTS FOR BOTH HEAT DISSIPATING AND NON HEAT DISSIPATING SPECIMENS
    IEC 60749-11:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 11: RAPID CHANGE OF TEMPERATURE - TWO-FLUID-BATH METHOD
    IEC 60749-36:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 36: ACCELERATION, STEADY STATE
    IEC 60068-2-11:1981 ENVIRONMENTAL TESTING - TEST KA: SALT MIST
    IEC 60749-18:2002 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
    IEC 60068-2-39:2015 ENVIRONMENTAL TESTING - PART 2-39: TESTS - TESTS AND GUIDANCE: COMBINED TEMPERATURE OR TEMPERATURE AND HUMIDITY WITH LOW AIR PRESSURE TESTS
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    IEC 60749-27:2006+AMD1:2012 CSV Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
    IEC 60749-16:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 16: PARTICLE IMPACT NOISE DETECTION (PIND)
    IEC 60068-2-31:2008 ENVIRONMENTAL TESTING - PART 2-31: TESTS - TEST EC: ROUGH HANDLING SHOCKS, PRIMARILY FOR EQUIPMENT-TYPE SPECIMENS
    IEC 60068-2-64:2008 Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance
    IEC 60068-2-53:2010 Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests
    IEC 60068-2-67:1995 ENVIRONMENTAL TESTING - PART 2: TESTS - TEST CY: DAMP HEAT, STEADY STATE, ACCELERATED TEST PRIMARILY INTENDED FOR COMPONENTS
    IEC 60749-9:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 9: PERMANENCE OF MARKING
    IEC 60068-2-38:2009 ENVIRONMENTAL TESTING - PART 2-38: TESTS - TEST Z/AD: COMPOSITE TEMPERATURE/HUMIDITY CYCLIC TEST
    IEC 60749-33:2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 33: ACCELERATED MOISTURE RESISTANCE - UNBIASED AUTOCLAVE
    IEC 60749-24:2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST
    IEC 60721-2-1:2013 CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - PART 2-1: ENVIRONMENTAL CONDITIONS APPEARING IN NATURE - TEMPERATURE AND HUMIDITY
    IEC 60068-2-47:2005 Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests
    IEC 60068-2-3:1969 ENVIRONMENTAL TESTING - TEST CA: DAMP HEAT, STEADY STATE
    IEC 60747-14-1:2010 SEMICONDUCTOR DEVICES - PART 14-1: SEMICONDUCTOR SENSORS - GENERIC SPECIFICATION FOR SENSORS
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    IEC 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
    IEC 60749-15:2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
    IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
    IEC 60721-3-0:1984+AMD1:1987 CSV CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - PART 3: CLASSIFICATION OF GROUPS OF ENVIRONMENTAL PARAMETERS AND THEIR SEVERITIES - INTRODUCTION
    IEC 60068-2-10:2005 Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth
    IEC 60749-35:2006 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 35: ACOUSTIC MICROSCOPY FOR PLASTIC ENCAPSULATED ELECTRONIC COMPONENTS
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60749-7:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES
    IEC 60068-2-9:1975 Environmental testing - Part 2: Tests. Guidance for solar radiation testing
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    IEC 60068-2-61:1991 Environmental testing - Part 2-61: Test methods - Test Z/ABDM:Climatic sequence
    IEC 60749-13:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 13: SALT ATMOSPHERE
    IEC 60068-2-80:2005 Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode
    IEC 60749-34:2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
    IEC 60749-6:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 6: STORAGE AT HIGH TEMPERATURE
    IEC 60068-2-42:2003 ENVIRONMENTAL TESTING - PART 2-42: TESTS - TEST KC: SULPHUR DIOXIDE TEST FOR CONTACTS AND CONNECTIONS
    IEC 60749-2:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 2: LOW AIR PRESSURE
    IEC 60068-2-75:2014 Environmental testing - Part 2-75: Tests - Test Eh: Hammer tests
    ISO/IEC Guide 2:2004 Standardization and related activities General vocabulary
    IEC 60068-2-29:1987 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST EB AND GUIDANCE: BUMP
    IEC 60068-2-28:1990 Environmental testing - Part 2: Tests. Guidance for damp heat tests
    IEC 60068-2-8 : 2ED 60 ENVIRONMENTAL TESTING - TESTS - TEST H: STORAGE
    IEC 60749-3:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
    IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
    IEC 60068-2-48:1982 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - GUIDANCE ON THE APPLICATION OF THE TESTS OF IEC 60068 TO SIMULATE THE EFFECTS OF STORAGE
    IEC 60068-2-55:2013 Environmental testing - Part 2-55: Tests - Test Ee and guidance - Loose cargo testing including bounce
    IEC 60068-2-44:1995 ENVIRONMENTAL TESTING - PART 2: TESTS - GUIDANCE ON TEST T: SOLDERING
    IEC 60749-32:2002+AMD1:2010 CSV Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
    IEC 60068-2-74:1999 ENVIRONMENTAL TESTING - PART 2-74: TESTS - TEST XC: FLUID CONTAMINATION
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    IEC 60749-14:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
    IEC 60749-19:2003+AMD1:2010 CSV Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
    IEC 60749-22:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH
    IEC 60068-2-52:2017 ENVIRONMENTAL TESTING - PART 2-52: TESTS - TEST KB: SALT MIST, CYCLIC (SODIUM CHLORIDE SOLUTION)
    IEC 60068-2-65:2013 Environmental testing - Part 2-65: Tests - Test Fg: Vibration - Acoustically induced method
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    IEC 60068-2-51 : 1.0 ENVIRONMENTAL TESTING - TESTS Z/BFc: COMBINED DRY HEAT/VIBRATION (SINUSOIDAL) TESTS FOR BOTH HEAT-DISSIPATING AND NON-HEAT-DISSIPATING SPECIMENS
    IEC 60749-12:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 12: VIBRATION, VARIABLE FREQUENCY
    IEC 60721-3-1:1997 CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - PART 3-1: CLASSIFICATION OF GROUPS OF ENVIRONMENTAL PARAMETERS AND THEIR SEVERITIES - STORAGE
    IEC 60068-2-46:1982 ENVIRONMENTAL TESTING - GUIDANCE TO TEST Kd: HYDROGEN SULPHIDE TEST FOR CONTACTS AND CONNECTIONS
    IEC 60068-2-59 : 1.0 ENVIRONMENTAL TESTING - TEST METHODS - TEST FE: VIBRATION - SINE-BEAT METHOD
    IEC 60749-23:2004+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
    IEC 60068-2-56 : 1.0 ENVIRONMENTAL TESTING - TEST CB: DAMP HEAT, STEADY STATE, PRIMARILY FOR EQUIPMENT
    IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
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