IPC J STD 609 : A
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MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
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IEC 60749-20:2008
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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IEC 60749-17:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
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IEC 60749-38:2008
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Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
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IEC 60749-8:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
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IEC 60749-21:2011
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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
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MIL-STD-883 Revision K:2016
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TEST METHOD STANDARD - MICROCIRCUITS
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IEC 60749-25:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
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IEC 60749-30:2005+AMD1:2011 CSV
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Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
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IEC 60749-5:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
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IEC 60749-4:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
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IEC 61340-5-1:2016
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Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
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SAE J 1879 : 2014
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HANDBOOK FOR ROBUSTNESS VALIDATION OF SEMICONDUCTOR DEVICES IN AUTOMOTIVE APPLICATIONS
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IEC 60749-29:2011
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Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
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MIL-PRF-19500 Revision P:2010
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SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
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IEC 62374:2007
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Semiconductor devices - Time dependent dielectric breakdown (TDDB) test for gate dielectric films
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IEC 62483:2013
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Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
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IEC 60749-36:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
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ISO/TS 16949:2009
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Quality management systems Particular requirements for the application of ISO 9001:2008 for automotive production and relevant service part organizations
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RTCA DO 254 : 2000
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DESIGN ASSURANCE GUIDANCE FOR AIRBORNE ELECTRONIC HARDWARE
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MIL-STD-750 Revision F:2011
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TEST METHODS FOR SEMICONDUCTOR DEVICES
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IEC 60749-9:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
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IEC TS 62239-1:2015
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Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
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IPC J STD 033C-1:2014
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HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
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ESDA/JEDEC JS-001 : 2017
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ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL
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IEC 60749-33:2004
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Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
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IEC TS 62564-1:2016
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Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
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IEC 60749-15:2010
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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
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IEC 60749-26:2013
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Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
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IEC 60749-7:2011
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Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
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ISO 14001:2015
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Environmental management systems — Requirements with guidance for use
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IPC J STD 035 : 0
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ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS
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IEC 62418:2010
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Semiconductor devices - Metallization stress void test
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IEC 60749-34:2010
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Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
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IEC 60749-6:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
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ISO 9001:2015
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Quality management systems — Requirements
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IEC 62416:2010
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Semiconductor devices - Hot carrier test on MOS transistors
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MIL-STD-1580 Revision B:2003
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DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS
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ESD S541 : 2008
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PACKAGING MATERIALS FOR ESD SENSITIVE ITEMS
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IEC 60749-3:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
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IEC 62417:2010
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Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
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IEC 60749-10:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
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IEC 60749-32:2002+AMD1:2010 CSV
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Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
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IEC 60695-11-5 : 2.0
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FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
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IEC 60695-11-5:2016
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Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance
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IEC 60749-14:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
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IEC 60749-19:2003+AMD1:2010 CSV
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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
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IEC 62415:2010
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Semiconductor devices - Constant current electromigration test
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IEC 60749-22:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
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IEC 60749-20-1:2009
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Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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IEC 60749-12:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
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IEC 62374-1:2010
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Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
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IEC 60749-23:2004+AMD1:2011 CSV
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Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
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